Rockwell-automation System Design for the Control of Electrical Noise Manuale Utente Pagina 27

  • Scaricare
  • Aggiungi ai miei manuali
  • Stampa
  • Pagina
    / 127
  • Indice
  • SEGNALIBRI
  • Valutato. / 5. Basato su recensioni clienti
Vedere la pagina 26
Publication GMC-RM001A-EN-P July 2001
High Frequency (HF) Bonding 2-9
Grid and Raised Floor
Bonding cabinet panels and machine chassis to a ground grid below a
raised floor is the best possible grounding scheme and commonly
used in computer mainframe installations, but rarely used in industrial
environments.
Ideally the grid squares should be 1 m (39 in.) or less.
Figure 2.7
Panel ground plane extended to a grid beneath a raised floor
Grid ground plane.
Copper strip laid on the floor,
covered by a false floor
(also bonded to machine structure).
Cabinet ground plane (panel)
bonded to floor ground plane
Machine structure used as ground plane
Vedere la pagina 26
1 2 ... 22 23 24 25 26 27 28 29 30 31 32 ... 126 127

Commenti su questo manuale

Nessun commento